O-Ring Supply Co.
ISO Certified
10,000+ O-Ring Sizes
Custom Manufacturing

Semiconductor O-Rings for Wafer Processing

Ultra-high purity FFKM and PTFE seals for plasma chambers, CVD, etch and deposition tools.

Semiconductor manufacturing requires seals that will not outgas, shed particles, or react with aggressive process chemistries. Plasma etch, chemical vapour deposition (CVD), and atomic layer deposition (ALD) chambers use fluorinated gases, strong oxidisers, and high temperatures that destroy standard elastomers within hours. We supply ultra-high purity FFKM (perfluoroelastomer) and virgin PTFE seals specifically formulated for semiconductor fab equipment. These materials resist O2 plasma, CF4, Cl2, NF3, and high-temperature process gases while maintaining extremely low particle generation and extractable levels.

Application Requirements

Requirement
Plasma resistance in O2, CF4, Cl2 and NF3 environments
Requirement
Low outgassing and minimal metallic ion content
Requirement
High temperature: up to +300°C in process chambers
Requirement
Ultra-high purity: no carbon black or interfering fillers
Requirement
Excellent chemical resistance to acids, solvents and bases
Requirement
Full lot traceability and cleanroom-compatible packaging

Recommended Materials

FFKM

Plasma etch chambers, CVD seals, ALD valve seals

Semiconductor / plasma grade (white or translucent)

PTFE

Static chamber seals, gas line fittings, pump seals

High-purity virgin

FKM

Less aggressive wet benches and auxiliary gas lines

High-fluorine, low-extractable

Design Tips

  • 1.Specify white or translucent FFKM to avoid carbon black particle contamination
  • 2.Use platinum-cured compounds where possible for the lowest metallic ion content
  • 3.Design grooves with 18–25% compression for static chamber seals
  • 4.Avoid lubricants that are not semiconductor-grade; specify dry or cleanroom-approved lubricants
  • 5.Package seals in nitrogen-purged bags to prevent contamination before installation

Common Sizes

SizeTypical Use
AS568-006 to AS568-050small gas line fittings
AS568-110 to AS568-178pump and valve seals
AS568-210 to AS568-284large chamber door and viewport seals
Custom sizes for specific chamber OEM drawingsGeneral application

Frequently Asked Questions

Why is FFKM preferred over FKM in plasma chambers?

FFKM has higher fluorine content and better thermal stability than FKM, making it far more resistant to plasma etching and aggressive oxidising chemistries used in semiconductor processing.

Can carbon-black-filled seals be used in semiconductor tools?

No. Carbon black can shed particles and contaminate wafers. Semiconductor-grade FFKM is typically white or translucent and uses non-carbon fillers.

What is the maximum temperature for FFKM in a process chamber?

Special high-temp FFKM grades can operate continuously up to +300°C and handle short-term excursions to +325°C in static seals.

Do you provide semiconductor-grade cleanliness certificates?

Yes. We provide lot-specific material certificates, outgassing data, and can support SEMI and AMS compliance requirements on request.

Request a custom quote

Request semiconductor-grade FFKM sample and data sheet